2-D 8-Node
Coupled-Field Solid
PLANE223 supports the following physics combinations:
Structural-Thermal
Piezoresistive
Electrostatic-Structural
Piezoelectric
Thermal-Electric
Structural-Thermoelectric
Thermal-Piezoelectric
Thermal-Magnetic
Thermal-Electric-Magnetic
Structural-Diffusion
Thermal-Diffusion
Electric-Diffusion
Thermal-Electric-Diffusion
Structural-Thermal-Diffusion
Structural-Electric-Diffusion
Structural-Thermal-Electric-Diffusion
The element has eight nodes with up to five degrees of freedom per node.
Structural capabilities include elasticity, plasticity, hyperelasticity, viscoelasticity, viscoplasticity, creep, large strain, large deflection, and stress stiffening effects. It also has mixed formulation capability for simulating deformations of nearly incompressible elastoplastic materials, and fully incompressible hyperelastic materials.
Piezoresistive capabilities include the piezoresistive effect. Piezoelectric capabilities include direct and converse piezoelectric effects. Electrostatic-structural capabilities include electrostatic force coupling. Thermoelectric capabilities include Seebeck, Peltier, and Thomson effects, as well as Joule heating. In addition to thermal expansion, structural-thermal capabilities include the piezocaloric effect in dynamic analyses. The Coriolis effect is available for analyses with structural degrees of freedom. The thermoplastic effect is available for analyses with structural and thermal degrees of freedom.
Thermo-electromagnetic capabilities include eddy current and Joule heating effects for transient analyses. In electromagnetic analyses, all VOLT degrees of freedom must be coupled (CP) in a 2-D electromagnetic region such that the voltage drop across the thickness has a single value. The element has nonlinear magnetic capability for modeling B-H curves or permanent magnet demagnetization curves for static and transient coupled-field analyses.
The diffusion expansion and hydrostatic stress-migration effects are available for analyses with structural and diffusion degrees of freedom. The thermo-migration effect (Soret effect) and the temperature-dependent saturated concentration effect is available for analyses with thermal and diffusion degrees of freedom. The electro-migration effect is available for analyses with electrical and diffusion degrees of freedom.
See PLANE223 in the Mechanical APDL Theory Reference for more details about this element.
The geometry, node locations, and the coordinate system for this element are shown in Figure 223.1: PLANE223 Geometry. The element input data includes eight nodes and structural, thermal, electrical, and magnetic material properties.
The type of units (MKS or user defined) for electromagnetic problems is specified through the EMUNIT command. EMUNIT also determines the value of free-space permittivity, EPZRO, and free-space permeability, MUZRO. The element input for magnetic material properties is the same as PLANE233; see "PLANE233 Input Data" for details.
KEYOPT(1) determines the element DOF set and the corresponding force labels and reaction solution. KEYOPT(1) is set equal to the sum of the field keys shown in Table 223.1: PLANE223 Field Keys. For example, KEYOPT(1) is set to 11 for a structural-thermal analysis (structural field key + thermal field key = 1 + 10). For a structural-thermal analysis, UX, UY, and TEMP are the DOF labels and force and heat flow are the reaction solution.
Table 223.1: PLANE223 Field Keys
Field | Field Key | DOF Label | Force Label | Reaction Solution |
---|---|---|---|---|
Structural | 1 | UX, UY | FX, FY | Force |
Thermal | 10 | TEMP | HEAT | Heat Flow |
Electric Conduction | 100 | VOLT | AMPS | Electric Current |
Electrostatic | 1000 | VOLT | CHRG | Electric Charge |
Magnetic | 10000 | AZ | CSGZ | Magnetic Current Segment |
Diffusion | 100000 | CONC | RATE | Diffusion Flow Rate |
The coupled-field analysis KEYOPT(1) settings, DOF labels, force labels, reaction solutions, and analysis types are shown in the following table.
Table 223.2: PLANE223 Coupled-Field Analyses
Coupled-Field Analysis | KEYOPT(1) | DOF Label | Force Label | Reaction Solution | Analysis Type |
---|---|---|---|---|---|
Structural-Thermal [1], [2] | 11 |
UX, UY, TEMP |
FX, FY, HEAT |
Force, Heat Flow |
Static Full Harmonic Full Transient |
Piezoresistive | 101 |
UX, UY, VOLT |
FX, FY, AMPS |
Force, Electric Current |
Static Full Transient |
Electrostatic-Structural | 1001 [3] |
UX, UY, VOLT |
FX, FY, CHRG |
Force, Electric Charge (negative) |
Static Full Transient Linear Perturbation Static Linear Perturbation Harmonic Linear Perturbation Modal |
Piezoelectric | 1001 [3] |
UX, UY, VOLT |
FX, FY, CHRG |
Force, Electric Charge (negative) |
Static Modal Linear Perturbation Modal Full, Linear Perturbation, or Mode Superposition Harmonic Full or Mode Superposition Transient |
Thermal-Electric | 110 |
TEMP, VOLT |
HEAT, AMPS |
Heat Flow, Electric Current |
Static Full Transient |
Structural-Thermoelectric [1] | 111 |
UX, UY, TEMP, VOLT |
FX, FY, HEAT, AMPS |
Force, Heat Flow, Electric Current |
Static Full Transient |
Thermal-Piezoelectric [1], [2] | 1011 |
UX, UY, TEMP, VOLT |
FX, FY, HEAT, CHRG |
Force, Heat Flow, Electric Charge (negative) |
Static Full Harmonic Full Transient |
Thermal-Magnetic | 10010 |
TEMP, AZ |
HEAT, CSGZ |
Heat Flow, Magnetic Current Segment |
Static Full Transient |
Thermal-Electric-Magnetic | 10110 |
TEMP, VOLT, AZ |
HEAT, AMPS CSGZ |
Heat Flow, Electric Current Magnetic Current Segment |
Static Full Transient |
Structural-Diffusion [1] | 100001 |
UX, UY, CONC |
FX, FY, RATE |
Force, Diffusion Flow Rate |
Static Full Transient |
Thermal-Diffusion [1] | 100010 |
TEMP, CONC |
HEAT, RATE |
Heat Flow, Diffusion Flow Rate |
Static Full Transient |
Electric-Diffusion [1] | 100100 |
VOLT, CONC, |
AMPS, RATE |
Electric Current, Diffusion Flow Rate |
Static Full Transient |
Thermal-Electric-Diffusion [1] | 100110 |
TEMP, VOLT, CONC |
HEAT, AMPS, RATE |
Heat Flow, Electric Current, Diffusion Flow Rate |
Static Full Transient |
Structural-Thermal-Diffusion [1] | 100011 |
UX, UY, TEMP, CONC |
FX, FY, HEAT, RATE |
Force, Heat Flow, Diffusion Flow Rate |
Static Full Transient |
Structural-Electric-Diffusion [1] | 100101 |
UX, UY, VOLT, CONC |
FX, FY, AMPS, RATE |
Force, Electric Current, Diffusion Flow Rate, |
Static, Full Transient |
Structural-Thermal-Electric-Diffusion [1] | 100111 |
UX, UY, TEMP, VOLT, CONC |
FX, FY, HEAT, AMPS, RATE |
Force, Heat Flow, Electric Current, Diffusion Flow Rate |
Static Full Transient |
For static and full transient analyses, KEYOPT(2) can specify a strong (matrix) or weak (load vector) structural-thermal, structural-diffusion, thermal-diffusion, and electric diffusion coupling.
For harmonic analyses, only strong coupling (KEYOPT(2) = 0) applies.
The electrostatic-structural analysis available with KEYOPT(1) = 1001 defaults to electrostatic force coupling, unless a piezoelectric matrix is specified on TB,PIEZ.
As shown in the following tables, material property requirements consist of those required for the individual fields (structural, thermal, electric conduction, electrostatic, magnetic, or diffusion) and those required for field coupling. Individual material properties are defined via the MP and MPDATA commands. Nonlinear and multiphysics material models are defined via the TB command. (The nonlinear material models do not apply to piezoelectric analyses (TB,PIEZ) where KEYOPT(1) = 1001 or 1011).
Nonlinear orthotropic magnetic properties can be specified with a combination of a B-H curve (TB,BH command) and linear relative permeability. The B-H curve is used in each element coordinate direction where a zero value of relative permeability is specified. Only one B-H curve may be specified per material.
Table 223.3: Structural Material Properties
Field | Field Key | Material Properties and Material Models |
---|---|---|
Structural | 1 |
EX, EY, EZ, PRXY, PRYZ, PRXZ (or NUXY, NUYZ, NUXZ), GXY, GYZ, GXZ, DENS, ALPD, BETD, DMPR ALPX, ALPY, ALPZ (or CTEX, CTEY, CTEZ, or THSX, THSY, THSZ), REFT --- Anisotropic hyperelasticity, Anisotropic elasticity, Bergstrom-Boyce, Bilinear isotropic hardening, Bilinear kinematic hardening, Cast iron, Chaboche nonlinear kinematic hardening, Creep, Elasticity, Extended Drucker-Prager, Gurson pressure-dependent plasticity, Hill anisotropy, Hyperelasticity, Mullins effect, Voce isotropic hardening law, Plasticity, Prony series constants for viscoelastic materials, Rate-dependent plasticity (viscoplasticity), Rate-independent plasticity, Material structural damping, Shift function for viscoelastic materials, Shape memory alloy, Uniaxial stress-strain relation |
Table 223.4: PLANE223 Material Properties and Material Models
Coupled-Field Analysis | KEYOPT(1) | Field | Material Properties and Material Models |
---|---|---|---|
Structural-Thermal | 11 | Structural | See Table 223.3: Structural Material Properties |
Thermal |
KXX, KYY, DENS, C, ENTH, HF | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE | ||
Piezoresistive [1] | 101 | Structural | See Table 223.3: Structural Material Properties |
Electric |
RSVX, RSVY, PERX, PERY | ||
Coupling | |||
Electrostatic-Structural | 1001 | Structural | See Table 223.3: Structural Material Properties |
Electric |
PERX, PERY --- | ||
Piezoelectric | 1001 | Structural | See Table 223.3: Structural Material Properties |
Electric |
PERX, PERY, LSST (and/or RSVX, RSVY) --- | ||
Coupling | |||
Thermal-Electric [1] | 110 | Thermal |
KXX, KYY, DENS, C, ENTH, HF |
Electric |
RSVX, RSVY, PERX, PERY | ||
Coupling |
SBKX, SBKY | ||
Structural-Thermoelectric | 111 | Structural | See Table 223.3: Structural Material Properties |
Thermal |
KXX, KYY, DENS, C, ENTH, HF | ||
Electric |
RSVX, RSVY, PERX, PERY | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE --- SBKX, SBKY --- | ||
Thermal-Piezoelectric | 1011 | Structural | See Table 223.3: Structural Material Properties |
Thermal |
KXX, KYY, DENS, C, ENTH, HF | ||
Electric |
PERX, PERY, LSST (and/or RSVX, RSVY) --- | ||
Coupling |
ALPX, ALPY, ALPZ, REFT --- | ||
Thermal-Magnetic | 10010 | Thermal |
KXX, KYY, DENS, C, ENTH |
Magnetic |
MURX, MURY, MGXX, MGYY --- | ||
Coupling |
RSVZ | ||
Thermal-Electric-Magnetic | 10110 | Thermal |
KXX, KYY, DENS, C, ENTH |
Electric | RSVZ | ||
Magnetic |
MURX, MURY, MGXX, MGYY --- | ||
Coupling | RSVZ | ||
Structural-Diffusion [1] | 100001 | Structural | See Table 223.3: Structural Material Properties |
Diffusion |
DXX, DYY, CSAT | ||
Coupling |
BETX, BETY, CREF --- | ||
Thermal-Diffusion [1] | 100010 | Thermal |
KXX, KYY, DENS, C, ENTH, HF |
Diffusion |
DXX, DYY, CSAT | ||
Coupling |
Temperature-dependent CSAT --- | ||
Electric-Diffusion [1] | 100100 | Electric |
RSVX, RSVY, PERX, PERY |
Diffusion |
DXX, DYY, CSAT | ||
Coupling | |||
Thermal-Electric-Diffusion [1] | 100110 | Thermal |
KXX, KYY, DENS, C, ENTH, HF |
Electric |
RSVX, RSVY, PERX, PERY | ||
Diffusion |
DXX, DYY, CSAT | ||
Coupling |
SBKX, SBKY --- Temperature-dependent CSAT --- | ||
Structural-Thermal-Diffusion [1] | 100011 | Structural | See Table 223.3: Structural Material Properties |
Thermal |
KXX, KYY, DENS, C, ENTH, HF | ||
Diffusion |
DXX, DYY, CSAT | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE --- BETX, BETY, CREF --- Temperature-dependent CSAT --- | ||
Structural-Electric-Diffusion [1] | 100101 | Structural | See Table 223.3: Structural Material Properties |
Electric |
RSVX, RSVY, PERX, PERY | ||
Diffusion |
DXX, DYY, CSAT | ||
Coupling |
BETX, BETY, CREF --- | ||
Structural-Thermal-Electric-Diffusion [1] | 100111 | Structural | See Table 223.3: Structural Material Properties |
Thermal |
KXX, KYY, DENS, C, ENTH, HF | ||
Electric |
RSVX, RSVY, PERX, PERY | ||
Diffusion |
DXX, DYY, CSAT | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE --- BETX, BETY, CREF --- SBKX, SBKY --- Temperature-dependent CSAT --- |
For this analysis type, some of the material properties can be defined as a function of primary variables by using tabular input on the MP command. For more information, see Defining Materials Using TABLE Type Array Parameters in the Mechanical APDL Basic Analysis Guide.
Various combinations of nodal loading are available for this element (depending upon the KEYOPT(1) value). Nodal loads are defined with the D and the F commands. Nodal forces, if any, should be input per unit of depth for a plane analysis and on a full 360° basis for an axisymmetric analysis.
Element loads are described in Nodal Loading. Surface loads may be input on the element faces indicated by the circled numbers in Figure 223.1: PLANE223 Geometry using the SF and SFE commands. Positive pressures act into the element. Body loads may be input at the element's nodes or as a single element value using the BF and BFE commands.
PLANE223 surface and body loads are given in the following table.
Most surface and body loads can be defined as a function of primary variables by using tabular input. For more information, see Applying Loads Using TABLE Type Array Parameters in the Mechanical APDL Basic Analysis Guide and the individual surface or body load command description in the Command Reference.
Table 223.5: PLANE223 Surface and Body Loads
Coupled-Field Analysis | KEYOPT(1) | Load Type | Load | Command Label | ||||||
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Structural-Thermal | 11 | Surface |
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Body |
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Piezoresistive | 101 | Surface |
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Body |
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Electrostatic-Structural and Piezoelectric | 1001 | Surface |
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Body |
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Thermal-Electric | 110 | Surface |
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Body |
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Structural-Thermoelectric | 111 | Surface |
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Body |
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Thermal-Piezoelectric | 1011 | Surface |
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Body |
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Thermal-Magnetic | 10010 | Surface |
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Body |
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Thermal-Electric-Magnetic | 10110 | Surface |
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Body |
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Structural-Diffusion | 100001 | Surface |
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Body |
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Thermal-Diffusion | 100010 | Surface |
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Body |
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Electric-Diffusion | 100100 | Surface |
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Body |
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Thermal-Electric-Diffusion | 100110 | Surface |
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Body |
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Structural-Thermal-Diffusion | 100011 | Surface |
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Structural-Electric-Diffusion | 100101 | Surface |
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Structural-Thermal-Electric-Diffusion | 100111 | Surface |
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Automatic element technology selections are given in the following table.
Table 223.6: Automatic Element Technology Selection
Coupled-Field Analysis | ETCONTROL Command Suggestions/Resettings |
---|---|
Structural-Thermal (KEYOPT(1) = 11) Structural-Thermoelactric (KEYOPT(1) = 111) | KEYOPT(2) = 1 for nonlinear inelastic materials |
A summary of the element input is given in "PLANE223 Input Summary". A general description of element input is given in Element Input. For axisymmetric applications see Harmonic Axisymmetric Elements.
I, J, K, L, M, N, O, P
Set by KEYOPT(1). See Table 223.2: PLANE223 Coupled-Field Analyses.
None
See Table 223.4: PLANE223 Material Properties and Material Models.
Birth and death |
Coriolis effect |
Element technology autoselect |
Large deflection |
Large strain |
Linear perturbation (electrostatic-structural and piezoelectric analyses only [KEYOPT(1) = 1001]) |
Nonlinear stabilization |
Stress stiffening |
Element degrees of freedom. See Table 223.2: PLANE223 Coupled-Field Analyses.
Coupling method between the DOFs for the following types of coupling: structural-thermal, structural-diffusion, thermal-diffusion, and electric-diffusion.
Strong (matrix) coupling. Produces an unsymmetric matrix. In a linear analysis, a coupled response is achieved after one iteration.
Weak (load vector) coupling. Produces a symmetric matrix and requires at least two iterations to achieve a coupled response.
Note: The weak coupling option (KEYOPT(2) = 1) can be used in a coupled electrostatic-structural analysis (KEYOPT(1) = 1001) to produce legacy element behavior. In this case, the reaction solution for the VOLT degree of freedom is positive charge (CHRG), and the analysis types are limited to static and full transient analyses. Linear perturbation analyses are not supported.
Element behavior:
Plane stress
Axisymmetric
Plane strain
Electrostatic force in electrostatic-structural analysis (KEYOPT(1) = 1001):
Applied to every element node.
Applied to the air-structure interface or to element nodes that have constrained structural degrees of freedom.
Not applied.
For more information, see Electrostatic-Structural Analysis in the Coupled-Field Analysis Guide.
Electromagnetic force output for coupled-field analysis:
At each element node (corner and midside)
At element corner nodes only (midside node forces are condensed to the corner nodes)
Electromagnetic force calculation for coupled-field analysis:
Maxwell
Lorentz
Thermoelastic damping (piezocaloric effect) in coupled-field analyses having structural and thermal DOFs. Applicable to harmonic and transient analyses only.
Active
Suppressed (required for frictional heating analyses)
Specific heat matrix in coupled-field analyses having the thermal DOF (TEMP), or damping matrix in coupled-field analyses having the diffusion DOF (CONC).
Consistent
Diagonalized
Diagonalized. Temperature-dependent specific heat or enthalpy is evaluated at the element centroid.
Element formulation in coupled-field analyses with structural DOFs:
Pure displacement formulation (default)
Mixed u-P formulation (not valid with plane stress)
The solution output associated with the element is in two forms:
Nodal degrees of freedom included in the overall nodal solution
Additional element output as shown in Table 223.7: PLANE223 Element Output Definitions.
The element output directions are parallel to the element coordinate system. A general description of solution output is given in Solution Output. See the Basic Analysis Guide for ways to view results.
The Element Output Definitions table uses the following notation:
A colon (:) in the Name column indicates that the item can be accessed by the Component Name method (ETABLE, ESOL). The O column indicates the availability of the items in the file Jobname.OUT. The R column indicates the availability of the items in the results file.
In either the O or R columns, “Y” indicates that the item is always available, a number refers to a table footnote that describes when the item is conditionally available, and “-” indicates that the item is not available.
Table 223.7: PLANE223 Element Output Definitions
Name | Definition | O | R |
---|---|---|---|
ALL ANALYSES | |||
EL | Element Number | - | Y |
NODES | Nodes - I, J, K, L, M, N, O, P | - | Y |
MAT | Material number | - | Y |
VOLU: | Volume | - | Y |
XC, YC | Location where results are reported | - | 2 |
ALL ANALYSES WITH A STRUCTURAL FIELD | |||
S:X, Y, Z, XY | Stresses (SZ = 0.0 for plane stress elements) | - | 1 |
S:1, 2, 3 | Principal stresses | - | 1 |
S:EQV | Equivalent stress | - | 1 |
EPEL:X, Y, Z, XY | Elastic strains | - | 1 |
EPTH:X, Y, Z, XY | Thermal strains | - | 1 |
EPTH:EQV | Equivalent thermal strain [3] | - | 1 |
EPPL:X, Y, Z, XY | Plastic strains | - | 1 |
EPPL:EQV | Equivalent plastic strain [3] | - | 1 |
EPCR:X, Y, Z, XY | Creep strains | - | 1 |
EPCR:EQV | Equivalent creep strain [3] | - | 1 |
EPTO:X, Y, Z, XY | Total mechanical strains (EPEL + EPPL + EPCR) | - | - |
EPTO:EQV | Total equivalent mechanical strain (EPEL + EPPL + EPCR) | - | - |
NL:SEPL | Plastic yield stress [10] | - | Y |
NL:EPEQ | Accumulated equivalent plastic strain [10] | - | Y |
NL:CREQ | Accumulated equivalent creep strain [10] | - | Y |
NL:SRAT | Plastic yielding (1 = actively yielding, 0 = not yielding) [10] | - | Y |
NL:HPRES | Hydrostatic pressure [10] | - | Y |
SENE: | Elastic strain energy | - | Y |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL ANALYSES (KEYOPT(1) = 11) [11] | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
UE | Elastic strain energy | - | 1 |
UT | Total strain energy [8] | - | 1 |
PHEAT | Plastic heat generation rate per unit volume | - | 1 |
ADDITIONAL OUTPUT FOR PIEZORESISTIVE ANALYSES (KEYOPT(1) = 101) [11] | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, SUM | Electric field components (X, Y) and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components (X, Y) and vector magnitude | - | 1 |
JS:X, Y, SUM | Current density components (in the global Cartesian coordinate system) (X, Y) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5] | - | 1 |
ADDITIONAL OUTPUT FOR ELECTROSTATIC-STRUCTURAL ANALYSES (KEYOPT(1) = 1001) [11] | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, SUM | Electric field components (X, Y) and vector magnitude | - | 1 |
D:X, Y, SUM | Electric flux density components (X, Y) and vector magnitude | - | 1 |
FMAG:X, Y, SUM | Electrostatic force components (X, Y) and vector magnitude | - | 1 |
UE, UD | Stored elastic and dielectric energies | - | 1 |
ADDITIONAL OUTPUT FOR PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1001) [11] | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, SUM | Electric field components (X, Y) and vector magnitude | - | 1 |
D:X, Y, SUM | Electric flux density components (X, Y) and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
UE, UM, UD | Elastic, mutual, and dielectric energies [7] | - | 1 |
UT | Total strain energy [8] | - | 1 |
THERMAL-ELECTRIC ANALYSES (KEYOPT(1) = 110) | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMOELECTRIC ANALYSES (KEYOPT(1) = 111) [11] | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
UT | Total strain energy [8] | - | 1 |
PHEAT | Plastic heat generation rate per unit volume | - | 1 |
ADDITIONAL OUTPUT FOR THERMAL-PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1011) [11] | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
D:X, Y, SUM | Electric flux density components and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
UE, UM, UD | Elastic, mutual, and dielectric energies [7] | - | 1 |
UT | Total strain energy [8] | - | 1 |
PHEAT | Plastic heat generation rate per unit volume | - | 1 |
THERMAL-MAGNETIC ANALYSES (KEYOPT(1) = 10010) | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
B:X, Y, SUM | Magnetic flux density components and vector magnitude | - | 1 |
H:X, Y, SUM | Magnetic field intensity components and vector magnitude | - | 1 |
FMAG:X, Y, SUM | Electromagnetic force components and magnitude | - | 1 |
JT:Z, SUM | Conduction current density Z component (in the global Cartesian coordinate system) and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume | - | 1 |
THERMAL-ELECTRIC-MAGNETIC ANALYSES (KEYOPT(1) = 10110) | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:Z, SUM | Electric field intensity Z component and vector magnitude | - | 1 |
JC:Z, SUM | Conduction current density Z component and vector magnitude | - | 1 |
B:X, Y, SUM | Magnetic flux density components and vector magnitude | - | 1 |
H:X, Y, SUM | Magnetic field intensity components and vector magnitude | - | 1 |
FMAG:X, Y, SUM | Electromagnetic force components and magnitude | - | 1 |
JT:Z, SUM | Conduction current density Z component (in the global Cartesian coordinate system) and vector magnitude | - | 1 |
JS:Z, SUM | Current density Z component (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-DIFFUSION ANALYSES (KEYOPT(1) = 100001) [11] | |||
TEMP | Input temperatures | - | Y |
EPDI:X, Y, Z, XY | Diffusion strains | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100010) | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100100) | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100110) | |||
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100101) [11] | |||
TEMP | Input temperatures | - | Y |
EPDI:X, Y, Z, XY | Diffusion strains | - | 1 |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100011) [11] | |||
EPDI:X, Y, Z, XY | Diffusion strains | - | 1 |
TG:X, Y, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100111) [11] | |||
EPDI:X, Y, Z, XY | Diffusion strains | - | 1 |
TF:X, Y, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, SUM | Conduction current density components and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
CG:X, Y, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
Solution values are output only if calculated (based on input values).
Available only at centroid as a *GET item.
The equivalent strains use an effective Poisson's ratio: for elastic and thermal this value is set by the user (MP,PRXY); for plastic and creep this value is set at 0.5.
JS represents the sum of element conduction and displacement current densities.
Calculated Joule heat generation rate per unit volume (JHEAT) may be made available for a subsequent thermal analysis with companion thermal elements.
For a time-harmonic analysis, Joule losses (JHEAT) are time-averaged. These values are stored in both the real and imaginary data sets. For more information, see Quasistatic Electric Analysis in the Mechanical APDL Theory Reference.
For a time-harmonic analysis, elastic (UE), mutual (UM), and dielectric (UD) energies are time-averaged. Their real part represents the average energy, while the imaginary part represents the average energy loss. For more information, see Piezoelectrics in the Mechanical APDL Theory Reference.
For a time-harmonic analysis, total strain (UT) energy is time-averaged. The real part represents the average energy, while the imaginary part represents the average energy loss. For more information, see Thermoelasticity in the Mechanical APDL Theory Reference.
With the normalized concentration approach, CONC is the actual concentration obtained by multiplying the saturated concentration (MP,CSAT) and the normalized concentration evaluated at the element centroid. For more information, see Normalized Concentration Approach in the Mechanical APDL Theory Reference.
Nonlinear solution, output only if the element has a nonlinear material, or if large-deflection effects are enabled (NLGEOM,ON).
Output listed for this coupled analysis is in addition to the structural field output at the beginning of this table.
Table 223.8: PLANE223 Item and Sequence Numbers lists output available through the ETABLE command using the Sequence Number method. See The General Postprocessor (POST1) of the Basic Analysis Guide and The Item and Sequence Number Table in this reference for more information. The following notation is used in Table 223.8: PLANE223 Item and Sequence Numbers:
output quantity as defined in the Table 223.7: PLANE223 Element Output Definitions
predetermined Item label for ETABLE command
sequence number for single-valued or constant element data
Table 223.8: PLANE223 Item and Sequence Numbers
Output Quantity Name | ETABLE Command Input | |
---|---|---|
Item | E | |
CONC | SMISC | 1 |
UE | NMISC | 1 |
UD | NMISC | 2 |
UM | NMISC | 3 |
UT | NMISC | 4 |
PHEAT | NMISC | 5 |
PLANE223 assumes a unit thickness.
PLANE223 uses 2 x 2 and 3 point integration rules to calculate the element matrices and load vectors for the quad and triangle geometries, respectively.
In a piezoelectric or electrostatic-structural analysis, electric charge loading is interpreted as negative electric charge or negative charge density.
In a coupled-field analysis with structural degrees of freedom, the model should have at least two elements in each direction to avoid the hourglass mode.
Optimized nonlinear solution defaults are applied in coupled-field analyses with structural degrees of freedom using this element.
The element must lie in a global X-Y plane as shown in Figure 223.1: PLANE223 Geometry and the Y-axis must be the axis of symmetry for axisymmetric analyses.
An axisymmetric structure should be modeled in the +X quadrants.
A face with a removed midside node implies that the degrees-of-freedom vary linearly, rather than parabolically, along that face. See Quadratic Elements (Midside Nodes) in the Modeling and Meshing Guide for more information about the use of midside nodes.
In an analysis with structural and diffusion degrees of freedom coupled by the stress migration effect (specified using TB,MIGR), the following are not supported:
midside nodes;
the weak coupling option (KEYOPT(2) = 1).
In a coupled-field electromagnetic analysis, all VOLT degrees of freedom must be coupled (CP).
This element may not be compatible with other elements with the VOLT degree of freedom. To be compatible, the elements must have the same reaction solution for the VOLT DOF. Elements that have an electric charge reaction solution must all have the same electric charge reaction sign. For more information, see Element Compatibility in the Low-Frequency Electromagnetic Analysis Guide.
When a coupled-field analysis with structural degrees of freedom uses mixed u-P formulation (KEYOPT(11) = 1), no midside nodes can be dropped. When using mixed formulation (KEYOPT(11) = 1), use the sparse solver (default).
Stress stiffening is always included in geometrically nonlinear (NLGEOM,ON) coupled-field analyses with structural degrees of freedom. Prestress effects can be activated via the PSTRES command.
Graphical Solution Tracking (/GST) is not supported with the coupled-diffusion analyses (KEYOPT(1) = 100001, 100010, and 100011).
Reaction forces are not available for an electrostatic-structural analysis (KEYOPT(1) = 1001) with the elastic air option (KEYOPT(4) = 1).