3-D 20-Node
Coupled-Field Solid
SOLID226 supports the following physics combinations:
Structural-Thermal
Piezoresistive
Electrostatic-Structural
Piezoelectric
Thermal-Electric
Structural-Thermoelectric
Thermal-Piezoelectric
Structural-Diffusion
Thermal-Diffusion
Electric-Diffusion
Thermal-Electric-Diffusion
Structural-Thermal-Diffusion
Structural-Electric-Diffusion
Structural-Thermal-Electric-Diffusion
The element has twenty nodes with up to six degrees of freedom per node.
Structural capabilities include elasticity, plasticity, hyperelasticity, viscoelasticity, viscoplasticity, creep, large strain, large deflection, and stress stiffening effects. It also has mixed formulation capability for simulating deformations of nearly incompressible elastoplastic materials, and fully incompressible hyperelastic materials.
Piezoresistive capabilities include the piezoresistive effect. Piezoelectric capabilities include direct and converse piezoelectric effects. Electrostatic-structural capabilities include electrostatic force coupling. Thermoelectric capabilities include Seebeck, Peltier, and Thomson effects, as well as Joule heating. In addition to thermal expansion, structural-thermal capabilities include the piezocaloric effect in dynamic analyses. The Coriolis effect is available for analyses with structural degrees of freedom. The thermoplastic effect is available for analyses with structural and thermal degrees of freedom.
The diffusion expansion and hydrostatic stress-migration effects are available for analyses with structural and diffusion degrees of freedom. The thermo-migration effect (Soret effect) and the temperature-dependent saturated concentration effect are available for analyses with thermal and diffusion degrees of freedom. The electro-migration effect is available for analyses with electrical and diffusion degrees of freedom.
See SOLID226 in the Mechanical APDL Theory Reference for more details about this element.
The geometry, node locations, and the coordinate system for this element are shown in Figure 226.1: SOLID226 Geometry. The element input data includes twenty nodes and structural, thermal, and electrical material properties. The type of units (MKS or user defined) is specified through the EMUNIT command. EMUNIT also determines the value of free-space permittivity EPZRO. The EMUNIT defaults are MKS units and EPZRO = 8.85e-12 Farads/meter.
KEYOPT(1) determines the element DOF set and the corresponding force labels and reaction solution. KEYOPT(1) is set equal to the sum of the field keys shown in Table 226.1: SOLID226 Field Keys. For example, KEYOPT(1) is set to 11 for a structural-thermal analysis (structural field key + thermal field key = 1 + 10). For a structural-thermal analysis, UX, UY, and TEMP are the DOF labels and force and heat flow are the reaction solution.
Table 226.1: SOLID226 Field Keys
Field | Field Key | DOF Label | Force Label | Reaction Solution |
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Structural | 1 | UX, UY, UZ | FX, FY, FZ | Force |
Thermal | 10 | TEMP | HEAT | Heat Flow |
Electric Conduction | 100 | VOLT | AMPS | Electric Current |
Electrostatic | 1000 | VOLT | CHRG | Electric Charge |
Diffusion | 100000 | CONC | RATE | Diffusion Flow Rate |
The coupled-field analysis KEYOPT(1) settings, DOF labels, force labels, reaction solutions, and analysis types are shown in the following table.
Table 226.2: SOLID226 Coupled-Field Analyses
Coupled-Field Analysis | KEYOPT(1) | DOF Label | Force Label | Reaction Solution | Analysis Type | |||||||||
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Structural-Thermal [1], [2] | 11 |
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Static Full Harmonic Full Transient | |||||||||
Piezoresistive | 101 |
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Static Full Transient | |||||||||
Electrostatic-Structural | 1001 [3] |
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Static Full Transient Linear Perturbation Static Linear Perturbation Harmonic Linear Perturbation Modal | |||||||||
Piezoelectric | 1001 [3] |
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Static Modal Linear Perturbation Modal Full, Linear Perturbation, or Mode Superposition Harmonic Full or Mode Superposition Transient | |||||||||
Thermal-Electric | 110 | TEMP, VOLT | HEAT, AMPS | Heat Flow, Electric Current |
Static Full Transient | |||||||||
Structural-Thermoelectric [1] | 111 |
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Static Full Transient | |||||||||
Thermal-Piezoelectric [1], [2] | 1011 |
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Static Full Harmonic Full Transient | |||||||||
Structural-Diffusion [1] | 100001 |
UX, UY, UZ, CONC |
FX, FY, FZ, RATE |
Force, Diffusion Flow Rate |
Static Full Transient | |||||||||
Thermal-Diffusion [1] | 100010 |
TEMP, CONC |
HEAT, RATE |
Heat Flow, Diffusion Flow Rate |
Static Full Transient | |||||||||
Electric-Diffusion [1] | 100100 |
VOLT, CONC |
AMP, RATE |
Electric Current, Diffusion Flow Rate |
Static Full Transient | |||||||||
Thermal-Electric Diffusion [1] | 100110 |
TEMP, VOLT, CONC |
HEAT, AMP, RATE |
Heat Flow, Electric Current, Diffusion Flow Rate |
Static Full Transient | |||||||||
Structural-Thermal-Diffusion [1] | 100011 |
UX, UY, UZ, TEMP, CONC |
FX, FY, FZ, HEAT, RATE |
Force, Heat Flow, Diffusion Flow Rate |
Static Full Transient | |||||||||
Structural-Electric-Diffusion [1] | 100101 |
UX, UY, UZ, VOLT, CONC |
FX, FY, FZ, AMPS, RATE |
Force, Electric Current, Diffusion Flow Rate |
Static Full Transient | |||||||||
Structural-Thermal-Electric-Diffusion [1] | 100111 |
UX, UY, UZ, TEMP, VOLT, CONC |
FX, FY, FZ, HEAT, AMPS, RATE |
Force, Heat Flow, Electric Current, Diffusion Flow Rate |
Static Full Transient |
For static and full transient analyses, KEYOPT(2) can specify a strong (matrix) or weak (load vector) structural-thermal, structural-diffusion, thermal-diffusion, and electric-diffusion coupling.
For harmonic analyses, only strong coupling (KEYOPT(2) = 0) applies.
The electrostatic-structural analysis available with KEYOPT(1) = 1001 defaults to electrostatic force coupling, unless a piezoelectric matrix is specified on TB,PIEZ.
As shown in the following tables, material property requirements consist of those required for the individual fields (structural, thermal, electric conduction, electrostatic, or diffusion) and those required for field coupling. Individual material properties are defined via the MP and MPDATA commands. Nonlinear and multiphysics material models are defined via the TB command. (The nonlinear material models do not apply to piezoelectric analyses (TB,PIEZ) where KEYOPT(1) = 1001 or 1011).
Table 226.3: Structural Material Properties
Field | Field Key | Material Properties and Material Models |
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Structural | 1 |
EX, EY, EZ, PRXY, PRYZ, PRXZ (or NUXY, NUYZ, NUXZ), GXY, GYZ, GXZ, DENS, ALPD, BETD, DMPR ALPX, ALPY, ALPZ (or CTEX, CTEY, CTEZ, or THSX, THSY, THSZ), REFT --- Anisotropic hyperelasticity, Anisotropic elasticity, Bergstrom-Boyce, Bilinear isotropic hardening, Bilinear kinematic hardening, Cast iron, Chaboche nonlinear kinematic hardening, Creep, Elasticity, Extended Drucker-Prager, Gurson pressure-dependent plasticity, Hill anisotropy, Hyperelasticity, Mullins effect, Voce isotropic hardening law, Plasticity, Prony series constants for viscoelastic materials, Rate-dependent plasticity (viscoplasticity), Rate-independent plasticity, Material structural damping, Shift function for viscoelastic materials, Shape memory alloy, Uniaxial stress-strain relation |
Table 226.4: SOLID226 Material Properties and Material Models
Coupled-Field Analysis | KEYOPT(1) | Field | Material Properties and Material Models |
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Structural-Thermal | 11 | Structural | See Table 226.3: Structural Material Properties |
Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE | ||
Piezoresistive [1] | 101 | Structural | See Table 226.3: Structural Material Properties |
Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ | ||
Coupling | |||
Electrostatic-structural | 1001 | Structural | See Table 226.3: Structural Material Properties |
Electric |
PERX, PERY, PERZ --- | ||
Piezoelectric | 1001 | Structural | See Table 226.3: Structural Material Properties |
Electric |
PERX, PERY, PERZ, LSST (and/or RSVX, RSVY, RSVZ) --- | ||
Coupling | |||
Thermal-Electric [1] | 110 | Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF |
Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ | ||
Coupling |
SBKX, SBKY, SBKZ | ||
Structural-Thermoelectric | 111 | Structural | See Table 226.3: Structural Material Properties |
Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF | ||
Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE --- SBKX, SBKY, SBKZ --- | ||
Thermal-Piezoelectric | 1011 | Structural | See Table 226.3: Structural Material Properties |
Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF | ||
Electric |
PERX, PERY, PERZ, LSST (and/or RSVX, RSVY, RSVZ) --- | ||
Coupling |
ALPX, ALPY, ALPZ, REFT --- | ||
Structural-Diffusion [1] | 100001 | Structural | See Table 226.3: Structural Material Properties |
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling |
BETX, BETY, BETZ, CREF --- | ||
Thermal-Diffusion [1] | 100010 | Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF |
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling |
Temperature-dependent CSAT --- | ||
Electric-Diffusion [1] | 100100 | Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ |
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling | |||
Thermal-Electric Diffusion [1] | 100110 | Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF |
Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ | ||
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling |
SBKX, SBKY, SBKZ --- Temperature-dependent CSAT --- | ||
Structural-Thermal-Diffusion [1] | 100011 | Structural | See Table 226.3: Structural Material Properties |
Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF | ||
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE --- BETX, BETY, BETZ, CREF --- Temperature-dependent CSAT --- | ||
Structural-Electric-Diffusion [1] | 100101 | Structural | See Table 226.3: Structural Material Properties |
Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ | ||
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling |
BETX, BETY, BETZ, CREF --- | ||
Structural-Thermal-Electric-Diffusion [1] | 100111 | Structural | See Table 226.3: Structural Material Properties |
Thermal |
KXX, KYY, KZZ, DENS, C, ENTH, HF | ||
Electric |
RSVX, RSVY, RSVZ, PERX, PERY, PERZ | ||
Diffusion |
DXX, DYY, DZZ, CSAT | ||
Coupling |
ALPX, ALPY, ALPZ, REFT, QRATE --- BETX, BETY, BETZ, CREF --- SBKX, SBKY, SBKZ --- Temperature-dependent CSAT --- |
For this analysis type, some of the material properties can be defined as a function of primary variables by using tabular input on the MP command. For more information, see Defining Materials Using TABLE Type Array Parameters in the Mechanical APDL Basic Analysis Guide.
Various combinations of nodal loading are available for this element (depending upon the KEYOPT(1) value). Nodal loads are defined with the D and the F commands.
Element loads are described in Nodal Loading. Loads may be input on the element faces indicated by the circled numbers in Figure 226.1: SOLID226 Geometry using the SF and SFE commands. Positive pressures act into the element. Body loads may be input at the element's nodes or as a single element value using the BF and BFE commands.
SOLID226 surface and body loads are given in the following table. CHRGS and CHRGD are interpreted as negative surface charge density and negative volume charge density, respectively.
Most surface and body loads can be defined as a function of primary variables by using tabular input. For more information, see Applying Loads Using TABLE Type Array Parameters in the Mechanical APDL Basic Analysis Guide and the individual surface or body load command description in the Command Reference.
Table 226.5: SOLID226 Surface and Body Loads
Coupled-Field Analysis | KEYOPT(1) | Load Type | Load | Command Label | ||||||
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Structural-Thermal | 11 | Surface |
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Body |
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Piezoresistive | 101 | Surface |
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Body |
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Electrostatic-Structural and Piezoelectric | 1001 | Surface |
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Body |
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Thermal-Electric | 110 | Surface |
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Body |
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Structural-Thermoelectric | 111 | Surface |
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Body |
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Thermal-Piezoelectric | 1011 | Surface |
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Body |
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Structural-Diffusion | 100001 | Surface |
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Body |
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Thermal-Diffusion | 100010 | Surface |
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Body |
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Electric-Diffusion | 100100 | Surface |
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Body |
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Thermal-Electric-Diffusion | 100110 | Surface |
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Body |
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Structural-Thermal-Diffusion | 100011 | Surface |
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Body |
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Structural-Electric-Diffusion | 100101 | Surface |
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Body |
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Structural-Thermal-Electric-Diffusion | 100111 | Surface |
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Body |
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Automatic element technology selections are given in the following table.
Table 226.6: Automatic Element Technology Selection
Coupled-Field Analysis | ETCONTROL Command Suggestions/Resettings |
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Structural-Thermal (KEYOPT(1) = 11) Structural-Thermoelectric (KEYOPT(1) = 111) | KEYOPT(2) =1 for nonlinear inelastic materials |
All analyses with a structural field | KEYOPT(6) =1 for linear elastic materials with Poisson's ratio >0.49 or nonlinear inelastic materials |
A summary of the element input is given in "SOLID226 Input Summary". A general description of element input is given in Element Input.
I, J, K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, Z, A, B
Set by KEYOPT(1). See Table 226.2: SOLID226 Coupled-Field Analyses.
None
See Table 226.4: SOLID226 Material Properties and Material Models.
Birth and death |
Coriolis effect |
Element technology autoselect |
Large deflection |
Large strain |
Linear perturbation (electrostatic-structural and piezoelectric analyses only [KEYOPT(1) = 1001]) |
Nonlinear stabilization |
Stress stiffening |
Element degrees of freedom. See Table 226.2: SOLID226 Coupled-Field Analyses.
Coupling method between the DOFs for the following types of coupling: structural-thermal, structural-diffusion, thermal-diffusion, and electric-diffusion.
Strong (matrix) coupling. Produces an unsymmetric matrix. In a linear analysis, a coupled response is achieved after one iteration.
Weak (load vector) coupling. Produces a symmetric matrix and requires at least two iterations to achieve a coupled response.
Note: The weak coupling option (KEYOPT(2) = 1) can be used in a coupled electrostatic-structural analysis (KEYOPT(1) = 1001) to produce legacy element behavior. In this case, the reaction solution for the VOLT degree of freedom is positive charge (CHRG), and the analysis types are limited to static and full transient analyses. Linear perturbation analyses are not supported.
Electrostatic force in electrostatic-structural analysis (KEYOPT(1) = 1001):
Applied to every element node.
Applied to the air-structure interface or to element nodes that have constrained structural degrees of freedom.
Not applied.
For more information, see Electrostatic-Structural Analysis in the Coupled-Field Analysis Guide.
Integration method (applicable to the brick-shaped elements with structural DOFs).
Full integration - uses 14 integrations points. This method can cause volumetric locking in the models with nearly incompressible materials. It is primary employed for purely linear analyses.
Uniform reduced integration - uses a 2 x 2 x 2 integration scheme. This method helps prevent volumetric mesh locking in the models with nearly incompressible materials. It is recommended for analyses with structural nonlinearities. To avoid the propagation of hourglass mode associated with the reduced integration, the model must have at least two layers of elements in each direction.
Thermoelastic damping (piezocaloric effect) in coupled-field analyses having structural and thermal DOFs. Applicable to harmonic and transient analyses only.
Active
Suppressed (required for frictional heating analyses)
Specific heat matrix in coupled-field analyses having the thermal DOF (TEMP), or damping matrix in coupled-field analyses having the diffusion DOF (CONC).
Consistent
Diagonalized
Diagonalized. Temperature-dependent specific heat or enthalpy is evaluated at the element centroid.
Element formulation in coupled-field analyses with structural DOFs:
Pure displacement formulation (default)
Mixed u-P formulation
The solution output associated with the element is in two forms:
Nodal degrees of freedom included in the overall nodal solution
Additional element output as shown in Table 226.7: SOLID226 Element Output Definitions.
The element output directions are parallel to the element coordinate system. A general description of solution output is given in Solution Output. See the Basic Analysis Guide for ways to view results.
The Element Output Definitions table uses the following notation:
A colon (:) in the Name column indicates that the item can be accessed by the Component Name method (ETABLE, ESOL). The O column indicates the availability of the items in the file Jobname.OUT. The R column indicates the availability of the items in the results file.
In either the O or R columns, “Y” indicates that the item is always available, a number refers to a table footnote that describes when the item is conditionally available, and “-” indicates that the item is not available.
Table 226.7: SOLID226 Element Output Definitions
Name | Definition | O | R |
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ALL ANALYSES | |||
EL | Element Number | - | Y |
NODES | Nodes - I, J, K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, Z, A, B | - | Y |
MAT | Material number | - | Y |
VOLU: | Volume | - | Y |
XC, YC, ZC | Location where results are reported | - | 2 |
ALL ANALYSES WITH A STRUCTURAL FIELD | |||
S:X, Y, Z, XY, YZ, XZ | Stresses (SZ = 0.0 for plane stress elements) | - | 1 |
S:1, 2, 3 | Principal stresses | - | 1 |
S:EQV | Equivalent stress | - | 1 |
EPEL:X, Y, Z, XY, YZ, XZ | Elastic strains | - | 1 |
EPEL:EQV | Equivalent elastic strain [3] | - | 1 |
EPTH:X, Y, Z, XY, YZ, XZ | Thermal strains | - | 1 |
EPTH:EQV | Equivalent thermal strain [3] | - | 1 |
EPPL:X, Y, Z, XY, YZ, XZ | Plastic strains | - | 1 |
EPPL:EQV | Equivalent plastic strain [3] | - | 1 |
EPCR:X, Y, Z, XY, YZ, XZ | Creep strains | - | 1 |
EPCR:EQV | Equivalent creep strain [3] | - | 1 |
EPTO:X, Y, Z, XY, YZ, XZ | Total mechanical strains (EPEL + EPPL + EPCR) | - | - |
EPTO:EQV | Total equivalent mechanical strain (EPEL + EPPL + EPCR) | - | - |
NL:SEPL | Plastic yield stress [10] | - | Y |
NL:EPEQ | Accumulated equivalent plastic strain [10] | - | Y |
NL:CREQ | Accumulated equivalent creep strain [10] | - | Y |
NL:SRAT | Plastic yielding (1 = actively yielding, 0 = not yielding) [10] | - | Y |
NL:HPRES | Hydrostatic pressure [10] | - | Y |
SENE: | Elastic strain energy | - | Y |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL ANALYSES (KEYOPT(1) = 11) | |||
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
UE | Elastic strain energy | - | 1 |
UT | Total strain energy [8] | - | 1 |
PHEAT | Plastic heat generation rate per unit volume | - | 1 |
ADDITIONAL OUTPUT FOR PIEZORESISTIVE ANALYSES (KEYOPT(1) = 101) | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, Z, SUM | Electric field components (X, Y, Z) and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components (X, Y, Z) and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5] | - | 1 |
ADDITIONAL OUTPUT FOR ELECTROSTATIC-STRUCTURAL ANALYSES (KEYOPT(1) = 1001) | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, Z, SUM | Electric field components (X, Y, Z) and vector magnitude | - | 1 |
D:X, Y, Z, SUM | Electric flux density components (X, Y, Z) and vector magnitude | - | 1 |
FMAG:X, Y, Z, SUM | Electrostatic force components (X, Y, Z) and vector magnitude | - | 1 |
UE, UD | Stored elastic and dielectric energies | - | 1 |
ADDITIONAL OUTPUT FOR PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1001) | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, Z, SUM | Electric field components (X, Y, Z) and vector magnitude | - | 1 |
D:X, Y, Z, SUM | Electric flux density components (X, Y, Z) and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
UE, UM, UD | Elastic, mutual, and dielectric energies [7] | - | 1 |
UT | Total strain energy [8] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-DIFFUSION ANALYSES (KEYOPT(1)=100001) | |||
TEMP | Input temperatures | - | Y |
EPDI:X, Y, Z, XY, YZ, XZ | Diffusion strains | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
THERMAL-ELECTRIC ANALYSES (KEYOPT(1) = 110) | |||
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMOELECTRIC ANALYSES (KEYOPT(1) = 111) | |||
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
UT | Total strain energy [8] | - | 1 |
PHEAT | Plastic heat generation rate per unit volume | - | 1 |
ADDITIONAL OUTPUT FOR THERMAL-PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1011) | |||
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
D:X, Y, Z, SUM | Electric flux density components and vector magnitude | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
UE, UM, UD | Elastic, mutual, and dielectric energies [7] | - | 1 |
UT | Total strain energy [8] | - | 1 |
PHEAT | Plastic heat generation rate per unit volume | - | 1 |
THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100010) | |||
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100100) | |||
TEMP | Input temperatures | - | Y |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100110) | |||
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100011) | |||
EPDI:X, Y, Z, XY, YZ, XZ | Diffusion strains | - | 1 |
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100101) | |||
TEMP | Input temperatures | - | Y |
EPDI:X, Y, Z, XY, YZ, XZ | Diffusion strains | - | 1 |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100111) | |||
EPDI:X, Y, Z, XY, YZ, XZ | Diffusion strains | - | 1 |
TG:X, Y, Z, SUM | Thermal gradient components and vector magnitude | - | 1 |
TF:X, Y, Z, SUM | Thermal flux components and vector magnitude | - | 1 |
EF:X, Y, Z, SUM | Electric field components and vector magnitude | - | 1 |
JC:X, Y, Z, SUM | Conduction current density components and vector magnitude | - | 1 |
JS:X, Y, Z, SUM | Current density components (in the global Cartesian coordinate system) and vector magnitude [4] | - | 1 |
JHEAT | Joule heat generation per unit volume [5], [6] | - | 1 |
CG:X, Y, Z, SUM | Concentration gradient components and vector magnitude | - | 1 |
DF:X, Y, Z, SUM | Diffusion flux components and vector magnitude | - | 1 |
CONC | Element concentration [9] | - | 1 |
Solution values are output only if calculated (based on input values).
Available only at centroid as a *GET item.
The equivalent strains use an effective Poisson's ratio: for elastic and thermal this value is set by the user (MP,PRXY); for plastic and creep this value is set at 0.5.
JS represents the sum of element conduction and displacement current densities.
Calculated Joule heat generation rate per unit volume (JHEAT) may be made available for a subsequent thermal analysis with companion thermal elements.
For a time-harmonic analysis, Joule losses (JHEAT) are time-averaged. These values are stored in both the real and imaginary data sets. For more information, see Quasistatic Electric Analysis in the Mechanical APDL Theory Reference.
For a time-harmonic analysis, elastic (UE), mutual (UM), and dielectric (UD) energies are time-averaged. Their real part represents the average energy, while the imaginary part represents the average energy loss. For more information, see Piezoelectrics in the Mechanical APDL Theory Reference.
For a time-harmonic analysis, total strain (UT) energy is time-averaged. The real part represents the average energy, while the imaginary part represents the average energy loss. For more information, see Thermoelasticity in the Mechanical APDL Theory Reference.
With the normalized concentration approach, CONC is the actual concentration obtained by multiplying the saturated concentration (MP,CSAT) and the normalized concentration evaluated at the element centroid. For more information, see Normalized Concentration Approach in the Mechanical APDL Theory Reference.
Nonlinear solution, output only if the element has a nonlinear material, or if large-deflection effects are enabled (NLGEOM,ON).
Table 226.7: SOLID226 Element Output Definitions lists output available through the ETABLE command using the Sequence Number method. See The General Postprocessor (POST1) of the Basic Analysis Guide and The Item and Sequence Number Table of this reference for more information. The following notation is used in Table 226.8: SOLID226 Item and Sequence Numbers:
output quantity as defined in the Table 226.7: SOLID226 Element Output Definitions
predetermined Item label for ETABLE command
sequence number for single-valued or constant element data
Table 226.8: SOLID226 Item and Sequence Numbers
Output Quantity Name | ETABLE Command Input | |
---|---|---|
Item | E | |
CONC | SMISC | 1 |
UE | NMISC | 1 |
UD | NMISC | 2 |
UM | NMISC | 3 |
UT | NMISC | 4 |
PHEAT | NMISC | 5 |
In a piezoelectric or electrostatic-structural analysis, electric charge loading is interpreted as negative electric charge or negative charge density.
Optimized nonlinear solution defaults are applied in coupled-field analyses with structural degrees of freedom using this element.
An edge with a removed midside node implies that the degrees-of-freedom varies linearly, rather than parabolically, along that edge. See Quadratic Elements (Midside Nodes) in the Modeling and Meshing Guide for more information about the use of midside nodes.
In an analysis with structural and diffusion degrees of freedom coupled by the stress migration effect (specified using TB,MIGR), the following are not supported:
midside nodes;
the weak coupling option (KEYOPT(2) = 1).
This element may not be compatible with other elements with the VOLT degree of freedom. To be compatible, the elements must have the same reaction solution for the VOLT DOF. Elements that have an electric charge reaction solution must all have the same electric charge reaction sign. For more information, see Element Compatibility in the Low-Frequency Electromagnetic Analysis Guide.
The model should have at least two layers of elements in each direction when uniform reduced integration (KEYOPT(6) = 1) is used.
When a coupled-field analysis with structural degrees of freedom uses mixed u-P formulation (KEYOPT(11) = 1), no midside nodes can be dropped. When using mixed formulation (KEYOPT(11) = 1), use the sparse solver (default).
Stress stiffening is always included in geometrically nonlinear (NLGEOM,ON) coupled-field analyses with structural degrees of freedom. Prestress effects can be activated via the PSTRES command.
Graphical Solution Tracking (/GST) is not supported with coupled-diffusion analyses (KEYOPT(1)=100001, 100010, and 100011).
Reaction forces are not available for an electrostatic-structural analysis (KEYOPT(1) = 1001) with the elastic air option (KEYOPT(4) = 1).